Novatel Wireless Announces Successful HSPA+ Dual-Carrier 40 Mbss Data Transmission

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Tuesday, 26 January 2010

Novatel Wireless Announces Successful HSPA+ Dual-Carrier Data Transmission with Qualcomm's MDM8220 Chipset

First Data Call with Peak Throughput of up to 40 Mbps Completed

SAN DIEGO, Jan 26, 2010  -- Novatel Wireless (Nasdaq: NVTL), a leading provider of wireless broadband solutions, today announced that it has successfully completed the first data transmission over dual-carrier HSPA+ using Qualcomm's industry-leading MDM8220(TM) chipset. Dual-carrier HSPA+ is a network innovation that will deliver more advanced data capabilities and support more compelling applications with richer user experiences. Novatel Wireless is working with operators and plans to launch commercial data devices based on the MDM8220(TM) in the second half of 2010.

"Novatel Wireless is continuously investing in research and development to ensure that we lead the market with cutting edge wireless data solutions," said Dr. Slim Souissi, CTO, Novatel Wireless. "We are very pleased to be working closely with industry technology leader Qualcomm to achieve these technical milestones, and we look forward to continuing to evolve our product line to deliver innovative solutions to meet the needs of our customers."

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